3D TSV is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
In 2019, the market size of 3D TSV is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D TSV.
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This report studies the global market size of 3D TSV, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the 3D TSV production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
Intel
Samsung
Toshiba
Amkor Technology
Pure Storage
Broadcom
Advanced Semiconductor Engineering
Taiwan Semiconductor Manufacturing Company
United Microelectronics
STMicroelectronics
Jiangsu Changing Electronics Technology
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Market Segment by Product Type
Memory
MEMS
CMOS Image Sensors
Imaging and Optoelectronics
Advanced LED Packaging
Others
Market Segment by Application
Electronics
Information and Communication Technology
Automotive
Military, Aerospace and Defence
Others
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
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